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| FOURNITURE ( FOURN) | Support salle blanche | Hugues Granier | Monique Dilhan | LAAS | Fourniture |
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| WAFERS / SUBSTRATS ( FOURN) | Photolithographie / Photolithography | Adrian Laborde | quentin gravelier | TEAM | Substrats |
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| wet bench for harmless chemistry NoMOS (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | Coillard | to be checked |
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| AAS (E-CARA) | Electrochimie/electroplating | David Bourrier | | Perkin Elmer | AAnalyst 400 AA |
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| AC450CT Pulvérisation NoMOS (D-PRST) | PVD | Ludovic Salvagnac | Guillaume Libaude | Alliance Concept | AC450CT |
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| acid wet bench for multicleaning and etching NoMOS (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | PTS | 092018-001 |
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| AFM ICON (C- AFM) | Caractérisation / characterization | Benjamin Reig | Emmanuelle Daran | BRUKER | Dimension ICON |
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| ALCATEL P1 MOS (G-DRIE) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | ALCATEL-ADIXEN | AMS4200-P1 |
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| ALCATEL P4 NoMOS (G-DRIE) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | Alcatel - Adixen | AMS4200 |
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| ALD Fiji MOS COMPATIBLE (T- CVD) | ALD | Pascal Dubreuil | scheid emmanuel | Cambridge Nanotech | Fiji F200 |
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| ALD TFS200 NoMOS (T-CVD) | ALD | Pascal Dubreuil | | BENEQ | TFS-200-232 |
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| ALD-LL NoMOS (T- CVD) | ALD | Pascal Dubreuil | | Sentech | Si-ALD-LL ALD024 |
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| Aligneur Suss MOS (A-INTE) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | SUSS | BA8 |
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| Altadrop NOMOS (J- JET) | Jet d'encre / ink jet | fabien mesnilgrente | Véronique Conédéra | Altatech | Altadrop |
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| ApSy E100 NoMOS (D-PRST) | PVD | Ludovic Salvagnac | Guillaume Libaude | Application Systemes | E100 |
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| Auroless (E-MANU) | Electrochimie/electroplating | David Bourrier | | Minaservices | 4" |
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| balance NOMOS (F-FRAI) | Caractérisation / characterization | fabien mesnilgrente | Véronique Conédéra | Mettler | AE100 |
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| Batch Buffer Oxide Etching 1-7 MOS (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | cybernétix | F143 4257 |
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| Boucle de refroidissement | Support salle blanche | quentin gravelier | Adrian Laborde | SPIE | XXX |
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| Capteurs sécurité gaz | Support salle blanche | Eric Imbernon | laurent bouscayrol | Honeywell | Satellite XT |
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| carotteuse ultra sonique MOS (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | fishione | 170 |
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| CCPECVD MOS COMPATIBLE (T- CVD) | PECVD | Pascal Dubreuil | Jean Christophe Marrot | ApSy | Multiplex CVD |
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| Centrale Eau DI | Support salle blanche | Hugues Granier | David Bourrier | C2R | LAAS 2005 |
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| Ceradrop NOMOS (J- JET) | Jet d'encre / ink jet | fabien mesnilgrente | Véronique Conédéra | Ceradrop | F-Series |
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| clean wet bench organic solvents NoMOS (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | DV Tech | Hotte |
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| Cvs (E-CARA) | Electrochimie/electroplating | David Bourrier | | Metrhom | Cvs |
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| D8-Discover (M- DRX) | Epitaxie / Epitaxy | Alexandre Arnoult | quentin gravelier | Bruker AXS | D8-Discover (Da Vinci) |
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| Découpe Graphtec (A-MONT) | Assemblage / Device mounting | Samuel Charlot | | Graphtec | FC8600 |
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| DIENER plasma O2 MOS (F-FRAI) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | DIENER | Nano |
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| Differential Scanning Calorimetry (C- DSC) | Caractérisation / characterization | Benjamin Reig | | NETZSCH | DSC 404 F3 Pegasus |
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| Digidrop (F-FRAI) | Caractérisation / characterization | Benjamin Reig | fabien mesnilgrente | GBX Instrument | Digidrop |
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| DILASE 3D HR NoMOS (L- 3D) | Lithographie laser / Laser lithography | Pierre-François Calmon | David Colin | KLOE | Dilase 3D |
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| DILASE 3D MR NoMOS (L- 3D) | Lithographie laser / Laser lithography | Pierre-François Calmon | David Colin | KLOE | Dilase 3DMR |
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| DILASE 750 NoMOS(L- 2D) | Lithographie laser / Laser lithography | Pierre-François Calmon | David Colin | KLOE | DILASE 750 |
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| DWL 200 NoMOS(L- DWL) | Lithographie laser / Laser lithography | Pierre-François Calmon | David Colin | HEIDELBERG INSTRUMENTS | DWL 200 |
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| ECR PECVD NoMOS (T-CVD) | PECVD | Pascal Dubreuil | Jean Christophe Marrot | Roth&Rau | AK400 |
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| Ellipsometre EP4 (C-SPEC) | Caractérisation / characterization | Benjamin Reig | Mairame Diallo | Accurion | Nanofilm EP4 |
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| Ellipsomètre HJY (C-SPEC) | Caractérisation / characterization | Benjamin Reig | Eric Imbernon | Horiba Jobin Yvon | Uvisel |
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| encolleuse (A-MONT) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | Janome | GLT JR2400N |
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| Etuve Horo (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | HORO | 250 |
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| étuve MEMMERT (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Memmert | UFB400 |
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| Etuve TETHYS (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | TETHYS | Fisher-Band |
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| étuve Thermox (F-FRAI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Thermo scientific | Vacutherm |
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| Etuve vieillissement thermique (A-MONT) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | Secasi | BC21 |
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| EVA 600 Evaporation NoMOS (D-PRST) | PVD | Ludovic Salvagnac | Guillaume Libaude | Alliance Concept | EVA 600 |
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| Evaporateur rotatif R-300 / Rotavaopr R-300 system professional | Synthèse chimique / chemical synthesis | Daniel FERRI ANGULO | Jean-Baptiste Doucet | BUCHI | R-300 |
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| EVG120 Automated Resist Processing System MOS and NoMOS (P-PHOT) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | EVG | 120 |
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| FC150 MOS (A-INTE) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | SET | FC150 |
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| Fer à souder Weller (F-FRAI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Weller | WSD81 |
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| FIB Dual Beam (C- FIB) | Caractérisation / characterization | Benjamin Reig | Mairame Diallo | FEI | Helios 600i |
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| Film monter UH-115 MOS (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Ultron Systems, Inc. | UH-115 |
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| Form 3 (L- 3D) | Assemblage / Device mounting | Samuel Charlot | Rémi Courson | Formlabs | Form 3 |
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| Four AET Bore MOS Compatible (T-FOUR) | Oxydation | Eric Imbernon | Jean Christophe Marrot | AET | Four d'oxydation |
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| Four AET Phosphore (T-FOUR) | Oxydation | Eric Imbernon | Jean Christophe Marrot | AET | Four d'oxydation |
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| Four AET Propre MOS Compatible (T-FOUR) | Oxydation | Eric Imbernon | Jean Christophe Marrot | AET | Four d'oxydation |
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| Four Alox (T-FOUR) | Oxydation | Guilhem Almuneau | | AET | Four d'oxydation |
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| Four de refusion NOMOS (A-INTE) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | Madell | TYR108C |
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| Four DIFPHOS6 MOS Compatible (T-FOUR) | redistribution, diffusion | Eric Imbernon | Jean Christophe Marrot | Centrotherm | Centronic E1550HT |
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| Four OXYBORE6 MOS Compatible (T-FOUR) | Oxydation | Eric Imbernon | Jean Christophe Marrot | Centrotherm | Centronic E1550HT |
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| Four OXYNIT6 MOS COMPATIBLE (T- CVD) | LPCVD | Eric Imbernon | Pascal Dubreuil | Centrotherm | Centronic E1550HT |
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| Four OXYPHOS6 MOS Compatible (T-FOUR) | Oxydation | Eric Imbernon | Jean Christophe Marrot | Centrotherm | Centronic E1550HT |
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| Four OXYPROP6 MOS Compatible (T-FOUR) | Oxydation | Eric Imbernon | Jean Christophe Marrot | Centrotherm | Centronic E1550HT |
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| Four RECUIT6 MOS Compatible (T-FOUR) | Recuits / Annealing | Eric Imbernon | Jean Christophe Marrot | Centrotherm | Centronic E1550HT |
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| Four SI3N46 MOS COMPATIBLE (T- CVD) | LPCVD | Eric Imbernon | Pascal Dubreuil | Centrotherm | Centronic E1550HT |
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| Four SIPOLY6 MOS COMPATIBLE (T- CVD) | LPCVD | Eric Imbernon | Pascal Dubreuil | Centrotherm | Centronic E1550HT |
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| Four Tempress Si-poly MOS COMPATIBLE (T- CVD) | LPCVD | Pascal Dubreuil | Eric Imbernon | Tempress | Dépot LPCVD |
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| FTIR (C-SPEC) | Caractérisation / characterization | Benjamin Reig | Jean-Baptiste Doucet | BRUKER | TENSOR 27 |
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| fume hood exploratory chemistry NoMOS (F-FRAI) | Synthèse chimique / chemical synthesis | Jean-Baptiste Doucet | Daniel FERRI ANGULO | to be precised | to be checked |
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| GenISys lab (LOGICI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | GenISys | Lab v4.7.0 |
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| Gérard Bauzil room | Robots humanoïdes | Olivier STASSE | Guilhem Saurel | N/A | N/A |
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| Glove box for HF based chemistry NoMOS (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | DVTECH | to be checked |
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| Gravure KOH (E-ANIS) | Procédés humides / Wet process benches | David Bourrier | | Minaservices | KOH |
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| Gravure TMAH (E-ANIS) | Procédés humides / Wet process benches | David Bourrier | | Minaservices | TMAH |
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| Grinder G&N MOS (A-POLI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Grinder | MPS2 R300 D CS |
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| HMDS Primer Obducat MOS and NoMOS (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Obducat Solar Semi | QS V 200 BM 200°C |
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| HMDS Primer oven MOS (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Yes | Yes |
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| HMP 90 NoMOS (L- DWL) | Lithographie laser / Laser lithography | Pierre-François Calmon | David Colin | SUSS | HMP 90 |
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| HMX NoMOS (L- DWL) | Lithographie laser / Laser lithography | Pierre-François Calmon | David Colin | SUSS | HMX |
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| Hotplate automated SU8 n°1 NoMOS (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Suss Microtec | HP |
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| Hotplate automated SU8 n°2 NoMOS (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Suss Microtec | HP |
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| Hotplate automated Thick Resists NoMOS (F-FRAI) | Photolithographie / Photolithography | Adrian Laborde | Laurent Mazenq | Osiris | HB20e |
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| Hotte implanteur (F-FRAI) | Implantation | Eric Imbernon | Jean Christophe Marrot | Minaservice | Hotte |
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| Hotte Litho laser NoMOS (F-FRAI) | Lithographie laser / Laser lithography | Pierre-François Calmon | David Colin | DV Tech | Paillasse |
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| hotte montage (F-FRAI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | unknouwn | unknouwn |
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| Hotte nano NoMos (F-FRAI) | Nano imprint | Franck Carcenac | Jean-Baptiste Doucet | DVTEch | Hotte nano |
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| Hotte polissage (F-FRAI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | unknouwn | unknouwn |
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| hotte solvants (F-FRAI) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | Mina services | inox |
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| Hotte Wafer Bonder (F-FRAI) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | Devetek | no model |
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| HRP2-N14 | Robots humanoïdes | Olivier STASSE | | Kawada | HRP2 |
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| ICP2 NoMos (G- ICP) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | Trikon (SPTS) | Omega 201 (1996) |
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| ICP3 NoMos (G- ICP) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | Trikon (SPTS) | Omega 201 (1994) |
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| ICPECVD MOS COMPATIBLE (T- CVD) | PECVD | Jean Christophe Marrot | Pascal Dubreuil | Oxford | Plasmalab 100 - HDPECVD |
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| Implanteur ionique IMC 200 MOS Compatible (I-IMPL) | Implantation | Eric Imbernon | Jean Christophe Marrot | Eaton | NV 4206 |
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| Jauge de mesure d'épaisseur MOS (A-POLI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Logitech | SYLVAC CH-1023 Crissier |
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| left organic solvents fume hood with lowerable window NoMOS (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | Fluidair | to be checked |
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| Mask Aligner Suss MA150 MOS and NoMOS (P-PHOT) | Photolithographie / Photolithography | Adrian Laborde | Laurent Mazenq | Suss Microtec | 150 CC |
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| Mask Aligner Suss MA6 Gen4 MOS and NoMOS (P-PHOT) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Suss Microtec | MABA6Gen4 |
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| Mask Aligner Suss MA6 NoMOS (P-PHOT) | Photolithographie / Photolithography | Adrian Laborde | Laurent Mazenq | Suss Microtec | 6 |
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| MASQUES/MASKS ( FOURN) | Lithographie laser / Laser lithography | Pierre-François Calmon | David Colin | TEAM | Masques |
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| MBE412 (M- EJM) | Epitaxie / Epitaxy | Alexandre Arnoult | quentin gravelier | RIBER SA | MBE412 |
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| MEB S-3700N (C- MEB) | Caractérisation / characterization | Benjamin Reig | Mairame Diallo | HITACHI | S-3700N |
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| MEB S-4800 (C- MEB) | Caractérisation / characterization | Benjamin Reig | Mairame Diallo | HITACHI | S-4800 |
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| Mesure planéité MOS (A-POLI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Logitech | GI20 |
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| Micro Injecteur (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Narishige | IM 300 |
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| Microscope leica photo auto (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Leica | DM4000M |
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| Microscope leica photo manuel (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Leica | DM-4000M |
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| Microscope optique Leica (F-FRAI) | Caractérisation / characterization | Benjamin Reig | Avatar Benjamin | LEICA | DM4000 |
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| Micro-soudeuse KnS 4526 MOS (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Kulicke and Soffa | 4526 |
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| Micro-soudeuse KnS 4700 MOS (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Kulicke and Soffa | 4700 |
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| Micro-soudeuse TPT HB-16 MOS (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | TPT | HB-16 |
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| MOS wet bench (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | Minaservice | mina-acidPP |
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| MOSNano wet bench (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | PTS-DVTECH | sorbonne |
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| Motion Capture system in G. Bauzil | Robots humanoïdes | Olivier STASSE | Guilhem Saurel | Qualisys | Miqus M3 |
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| Nano-imprint equipment NoMos (N- NEX) | Nano imprint | Jean-Baptiste Doucet | Emmanuelle Daran | Nanonex | NX2500 |
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| Nettoyage wafers UH-117 MOS (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Ultron Systems, Inc. | UH-117 |
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| Nitrogen atmosphere oven (F-FRAI) | Integration/ Device mounting | Adrian Laborde | | Verder / Carbolite | HTMA4028-230SN |
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| Olympus MX50 (F-FRAI) | Caractérisation / characterization | Aurélie LECESTRE | laurent bouscayrol | Olympus | MX50 |
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| optical microscope NIKON NoMOS(F-FRAI) | Caractérisation / characterization | Jean-Baptiste Doucet | | NIKON | to be checked |
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| oscilloscope (F-FRAI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Tektronix | TDS-2012 |
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| Oven polymers NoMOS (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Memmert | XXXX |
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| Paillasse Chime EJM - Solvants - III/V (F-FRAI) | Epitaxie / Epitaxy | quentin gravelier | Alexandre Arnoult | LAAS | Paillasse PVC LAAS |
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| Paillasse Chime EJM- Acides - III/V (F-FRAI) | Epitaxie / Epitaxy | quentin gravelier | Alexandre Arnoult | LAAS | Paillasse PVC LAAS |
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| Paillasse Chime EJM-1 (F-FRAI) | Epitaxie / Epitaxy | quentin gravelier | Alexandre Arnoult | LAAS | Paillasse PVC LAAS |
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| Paillasse de Développement & Stripping (F-FRAI) | Procédés humides / Wet process benches | David Bourrier | | LAAS | Developpement |
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| Paillasse de Développement & Ultrason (F-FRAI) | Procédés humides / Wet process benches | David Bourrier | | Minaservices | Ultrasons |
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| Paillasse dépôts Alternatifs (E-MANU) | Electrochimie/electroplating | David Bourrier | | LAAS | n°1 |
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| paillasse electroless NOMOS (E-MANU) | Procédés humides / Wet process benches | Véronique Conédéra | fabien mesnilgrente | Coillard | paillasse pvc |
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| paillasse jet d'encre NOMOS (F-FRAI) | Procédés humides / Wet process benches | fabien mesnilgrente | Véronique Conédéra | Coillard | paillasse pvc |
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| Parylene C30S (D-PARY) | PVD | Guillaume Libaude | Adrian Laborde | Comelec | C30S |
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| PECS (D-PRST) | PVD | Benjamin Reig | Franck Carcenac | GATAN | PECS |
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| PHOTONIC PROFESSIONAL NoMOS (L- 3D) | Lithographie laser / Laser lithography | Pierre-François Calmon | David Colin | NANOSCRIBE | PHOTONIC PROFESSIONAL |
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| plaque chauffante 300°Cx (A-INTE) | Integration/ Device mounting | Samuel Charlot | David Bourrier | Sawatec | HP-401-Z |
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| Plassys nano MOS (D-PRST) | PVD | Ludovic Salvagnac | Guillaume Libaude | Plassys | Nano |
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| Plassys Organiques NoMOS (D-OLED) | PVD | Ludovic Salvagnac | Guillaume Libaude | Plassys | MEB550B |
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| Polarographie (E-CARA) | Electrochimie/electroplating | David Bourrier | | Metrhom | 797 VA Computrace |
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| polisseuse ESCIL (A-POLI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Escil | ESC200 |
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| Polisseuse PM5 MOS (A-POLI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Logitech | PM5 |
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| Portes automatiques salle blanche | Support salle blanche | Emmanuelle Daran | Laurent Mazenq | Portalp | xx |
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| Profilomètre mécanique Tencor P16+ (F-FRAI) | Caractérisation / characterization | Benjamin Reig | Mairame Diallo | KLA Tencor | Tencor P16+ |
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| Profilomètre mécanique Tencor P17 (F-FRAI) | Caractérisation / characterization | Benjamin Reig | Mairame Diallo | KLA Tencor | Tencor P17 |
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| Profilomètre optique LEXT (F-FRAI) | Caractérisation / characterization | Benjamin Reig | fabien mesnilgrente | Olympus | OLS LEXT 3100 |
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| Profilomètre optique SNEOX (F-FRAI) | Caractérisation / characterization | Benjamin Reig | Mairame Diallo | SensoFar | SNEOX |
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| Profilomètre optique Wyko (F-FRAI) | Caractérisation / characterization | Benjamin Reig | | VEECO | WYKO 3300 |
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| Pull shear testeur MOS (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Xyztec | condor sygma |
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| Pyrene | Robots humanoïdes | Olivier STASSE | Guilhem Saurel | PAL-Robotics | TALOS |
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| RAITH150 NoMos (N-RAIT) | Lithographie électronique / Ebeam lithography | Franck Carcenac | Aurélie LECESTRE | RAITH | RAITH150 Version1 |
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| RCA/Piranha cleaning MOS (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | VACO | to be checked |
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| Réacteur synthèse 1000mL/ Chemical reactor 1000mL | Synthèse chimique / chemical synthesis | Daniel FERRI ANGULO | Jean-Baptiste Doucet | IKA | EasySyn 1000 Package |
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| Réacteur synthèse 500mL / Chemical reactor 500mL | Synthèse chimique / chemical synthesis | Daniel FERRI ANGULO | Jean-Baptiste Doucet | IKA | EasySyn 500 Package |
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| Recuit Au et Cu sur Si (T-FOUR) | Recuits / Annealing | Eric Imbernon | Jean Christophe Marrot | ASM | Four horizontal LB 35 |
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| Recuit Au et Cu sur tout substrats (T-FOUR) | Recuits / Annealing | Eric Imbernon | Jean Christophe Marrot | ASM | Four horizontal LB 35 |
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| Recuit ferrite 6" (T-FOUR) | Recuits / Annealing | Jean Christophe Marrot | Eric Imbernon | AET | Bati de recuit 2 tubes MT/HT |
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| Recuit métaux divers sauf Au et Cu sur Si (T-FOUR) | Recuits / Annealing | Eric Imbernon | Jean Christophe Marrot | ASM | Four horizontal LB 35 |
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| Recuit métaux lourds 6" (T-FOUR) | Recuits / Annealing | Jean Christophe Marrot | Eric Imbernon | AET | Bati de recuit 2 tubes MT |
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| Recuit Polyimide (T-FOUR) | Recuits / Annealing | Jean Christophe Marrot | Eric Imbernon | AET | Bati de recuit 2 tubes MT |
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| Recuit verre 6" (T-FOUR) | Recuits / Annealing | Jean Christophe Marrot | Eric Imbernon | AET | Bati de recuit 2 tubes MT/HT |
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| Rena Cuivre 4 pouces (E-AUTO) | Electrochimie/electroplating | David Bourrier | | RENA | EPM 100 F |
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| Rena Nickel 4 pouces (E-AUTO) | Electrochimie/electroplating | David Bourrier | | RENA | EPM 100 F |
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| Rena Or 4 pouces (E-AUTO) | Electrochimie/electroplating | David Bourrier | | RENA | EPM 100 F |
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| Report eutectique KnS 6482 MOS (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Kulicke and Soffa | 6482 |
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| Report flip chip MOS (A-INTE) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | SET | FC150 |
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| Report/Collage Tresky T3000 MOS (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Dr Tresky | T3000 |
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| Report/Collage Tresky T4907 MOS (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Dr Tresky | T4907 |
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| réseau air sec | Support salle blanche | Ludovic Salvagnac | Benjamin Reig | SOME Industrie | Compair LRS22 10 bars |
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| Résistivimètre automatique (F-FRAI) | Caractérisation / characterization | Benjamin Reig | Eric Imbernon | Changmin Tech | CMT-SR200 |
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| Résistivimètre manuel (F-FRAI) | Caractérisation / characterization | Benjamin Reig | Eric Imbernon | --- | --- |
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| Riber degas NoMOS (D-PRST) | PVD | Ludovic Salvagnac | Guillaume Libaude | Riber | Degas |
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| right organic solvents fume hood with lowerable window NoMOS (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | Fluidair | to be checked |
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| Romeo | Robots humanoïdes | Olivier STASSE | | Softbank robotics | Romeo 3 |
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| RTP As-Master MOS Compatible (T-FOUR) | Recuits / Annealing | Jean Christophe Marrot | Eric Imbernon | Annealsys | AS-Master-2000HT |
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| RTP As-One (T-FOUR) | Recuits / Annealing | Jean Christophe Marrot | Eric Imbernon | Annealsys | AS-ONE |
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| Scie diamanté DAD-321 MOS (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | DISCO | DAD-321 |
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| Scriber JFP-S100 MOS (A-MONT) | Assemblage / Device mounting | Samuel Charlot | | CEFORI | JFP-S100 |
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| Scriber Karl-SUSS RH-100 MOS (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Karl-SUSS | RH-100 |
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| Scriber SET MOS (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | SET | A3 |
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| Scrubber éffluents gaz fours | Support salle blanche | Eric Imbernon | laurent bouscayrol | Centrotherm | CT-BW |
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| semitool Spin Rinse Dryer Main Chem NoMOS (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | Semitool | PSC-101 |
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| sérigraphie MOS (A-INTE) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | DEK | 01i |
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| SFD NOMOS (J-TRAI) | Traitement de surface / Surface treatment | fabien mesnilgrente | | 31 degrees | SFD 200 |
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| Shipley 3024 MOS (A-INTE) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | Shipley | 3024 |
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| Shipley 360 MOS (A-INTE) | Integration/ Device mounting | Samuel Charlot | | Shipley | 360 |
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| SI200 MOS (G- ICP) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | SENTECH | Etchlab 200 |
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| SI500-Chlorée MOS (G- ICP) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | SENTECH | SI500 |
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| SI500-Fluorée NoMOS (G-DRIE) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | SENTECH | SI500-DRIE |
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| Sonication cabin NoMOS (F-FRAI) | Other processes | Jean-Baptiste Doucet | | DVTECH | Autotune |
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| Sorbonne dépôt électrolytiques | Electrochimie/electroplating | David Bourrier | | PTS | Yamamoto 4-6 pouces |
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| SPD NOMOS (J-TRAI) | Traitement de surface / Surface treatment | fabien mesnilgrente | | MEMSSTAR | SPD |
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| spectroline 248nm NOMOS (F-FRAI) | Traitement de surface / Surface treatment | Véronique Conédéra | fabien mesnilgrente | spectroline | PC-2200A |
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| Spectromètre UV-VIS (C-SPEC) | Caractérisation / characterization | Benjamin Reig | | PerkinElmer | lambda650 |
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| SprayCoater Suss Microtec NoMOS (P-PHOT) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Suss Microtec | Altaspray |
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| station de neutralisation des effluents liquides | Support salle blanche | Jean-Baptiste Doucet | David Bourrier | Veolia | Custom |
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| Stepper I Line Canon MOS and NoMOS (P-PHOT) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Canon | FPA 3000i4/i5 |
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| Système de traitement d'air | Support salle blanche | Hugues Granier | | Divers | Dievrs |
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| Tankers azote liquide | Support salle blanche | quentin gravelier | Hugues Granier | Linde | 20 000 l et 50 000 l |
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| TEPLA plasma O2 NoMOS (F-FRAI) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | TEPLA | 300 semi-auto |
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| TERGEO NoMOS (F-FRAI) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | PIE SCIENTIFIC | TERGEO Plus Plasma Cleaner |
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| Test Tool 2 | Support salle blanche | Martin (Admin) Klarqvist | | Intiro Development AB | One tool to rule them all |
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| Test Tool 3 | Support salle blanche | Martin (Admin) Klarqvist | | Intiro Development AB | One tool to rule them all 2 |
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| Test tool wrong | Support salle blanche | Hugues Granier | | Testbolaget | A |
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| Testeur sous pointes (F-FRAI) | Caractérisation / characterization | Benjamin Reig | Eric Imbernon | SET | TR5230 |
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| TFE 644 Pulvérisation NoMOS (D-PRST) | PVD | Ludovic Salvagnac | Guillaume Libaude | Thin FIlm Equipment (TFE) | 644 |
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| ThermoGravimetric Analysis TGA (C- DSC) | Caractérisation / characterization | Benjamin Reig | fabien mesnilgrente | Mettler-Toledo | TGA-02 |
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| Titration (E-CARA) | Electrochimie/electroplating | David Bourrier | | Metrhom | Titrando |
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| Tousimis NOMOS (J-TRAI) | Traitement de surface / Surface treatment | fabien mesnilgrente | Véronique Conédéra | Tousimis | 915B |
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| Univex 450 Pulvérisation NoMOS (D-PRST) | PVD | Ludovic Salvagnac | Guillaume Libaude | Oerlikon | Univex 450C |
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| UV Ozone NOMOS (F-FRAI) | Traitement de surface / Surface treatment | fabien mesnilgrente | Véronique Conédéra | Jelight | 42 |
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| UV -ozone NoMOS(F-FRAI) | Traitement de surface / Surface treatment | Jean-Baptiste Doucet | | Jelight | 42-220 |
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| Vacuo-temp NOMOS (F-FRAI) | Traitement de surface / Surface treatment | fabien mesnilgrente | Véronique Conédéra | J.P. SELECTA | Vacuo-temp |
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| Wafer bonder AML MOS (A-INTE) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | AML | WB4 |
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| Wafer bonder SUSS NOMOS (A-INTE) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | SUSS | SB6e |
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| Wafer Substrate Bonding MOS (A-POLI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Logitech | WSB1 |
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| Varian Evaporation NoMOS (D-PRST) | PVD | Ludovic Salvagnac | Guillaume Libaude | MTB Solutions | Varian 3616 |
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| wet batch photoresist stripping by AZ100 remover NoMOS(F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | VACO | to be checked |
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| Wet Bench / Photo 1 NoMOS resist development (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Minaservice | NC |
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| Wet Bench / Photo 1 NoMOS resist spinner (F-FRAI) | Photolithographie / Photolithography | Mairame Diallo | Adrian Laborde | Suss Microtec | LabSpin6 BM |
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| Wet Bench / Photo 2 NoMOS resist development (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Minaservice | NC |
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| Wet Bench / Photo 2 NoMOS resist spinner (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Suss Microtec | RC8 |
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| Wet Bench / Photo 3 MOS resist development (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Minaservice | NC |
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| Wet Bench / Photo 3 MOS resist spinner (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Suss Microtec | RC8 |
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| wet bench III-V NoMOS(F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | Coillard | to be checked |
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| wet bench metal etching NoMOS(F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | VACO | wet bench |
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| wet bench organic solvents PDMS and outgasing NoMOS (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | PTS | Hotte |
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| viscosimètre (F-FRAI) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | Fungilab | smart |
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| viscosimètre NOMOS (F-FRAI) | Caractérisation / characterization | fabien mesnilgrente | Véronique Conédéra | anton paar | AMVn |
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| Yamamoto 4'' (E-MANU) | Electrochimie/electroplating | David Bourrier | | Yamamoto | Smart Cell 4 '' |
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| Yamamoto Cuivre 4/6" (E-MANU) | Electrochimie/electroplating | David Bourrier | | LAAS | Plating Set 4'' and 6 '' |
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| Yamamoto Nickel 4/6" (E-MANU) | Electrochimie/electroplating | David Bourrier | | Yamamoto | Plating Set 4'' and 6 '' |