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| FOURNITURE ( FOURN) | Support salle blanche | Hugues Granier | Monique Dilhan | LAAS | Fourniture |
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| WAFERS / SUBSTRATS ( FOURN) | Photolithographie / Photolithography | Adrian Laborde | quentin gravelier | TEAM | Substrats |
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| wet bench for harmless chemistry (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | Coillard | to be checked |
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| AAS (E-CARA) | Electrochimie/electroplating | David Bourrier | Justine Bonneau | Perkin Elmer | AAnalyst 400 AA |
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View
| AC450CT Pulvérisation (D-PRST) | PVD | Ludovic Salvagnac | Guillaume Libaude | Alliance Concept | AC450CT |
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| acid wet bench for multicleaning and etching (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | PTS | 092018-001 |
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| AFM DIMENSION (C- AFM) | Caractérisation / characterization | Benjamin Reig | Emmanuelle Daran | VEECO | Dimension 3100 |
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| AFM ICON (C- AFM) | Caractérisation / characterization | Benjamin Reig | Emmanuelle Daran | BRUKER | Dimension ICON |
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View
| ALCATEL P1 (G-DRIE) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | ALCATEL-ADIXEN | AMS4200-P1 |
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| ALCATEL P4 (G-DRIE) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | Alcatel - Adixen | AMS4200 |
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| ALD MOS (T- CVD) | ALD | Pascal Dubreuil | scheid emmanuel | Cambridge Nanotech | Fiji F200 |
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| ALD-NOMOS (T- CVD) | ALD | Pascal Dubreuil | scheid emmanuel | Sentech | Si-ALD-LL ALD024 |
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| Aligneur Suss (A-INTE) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | SUSS | BA8 |
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| Altadrop (J- JET) | Jet d'encre / ink jet | fabien mesnilgrente | Véronique Conédéra | Altatech | Altadrop |
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| ApSy E100 (D-PRST) | PVD | Ludovic Salvagnac | Guillaume Libaude | Application Systemes | E100 |
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| Aspiration centralisée | Support salle blanche | Hugues Granier | | axpirtech aldes | axpirtechh FH34-2 |
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| Auroless (E-MANU) | Electrochimie/electroplating | David Bourrier | Justine Bonneau | Minaservices | 4" |
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| balance (F-FRAI) | Caractérisation / characterization | fabien mesnilgrente | Véronique Conédéra | Mettler | AE100 |
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| Batch Buffer Oxide Etching 1-7 MOS (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | Eric Imbernon | cybernétix | F143 4257 |
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| Boucle de refroidissement | Support salle blanche | Hugues Granier | | SPIE | XXX |
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| carotteuse ultra sonique (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | fishione | 170 |
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| Centrale Eau DI | Support salle blanche | Hugues Granier | | C2R | LAAS 2005 |
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| Ceradrop (J- JET) | Jet d'encre / ink jet | fabien mesnilgrente | Véronique Conédéra | Ceradrop | F-Series |
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| clean wet bench organic solvents (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | Tom Gouveia | DV Tech | Hotte |
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| Cvs (E-CARA) | Electrochimie/electroplating | David Bourrier | Justine Bonneau | Metrhom | Cvs |
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View
| D8-Discover (M- DRX) | Epitaxie / Epitaxy | Alexandre Arnoult | quentin gravelier | Bruker AXS | D8-Discover (Da Vinci) |
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View
| Découpe Graphtec (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Guy ARDIT | Graphtec | FC8600 |
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View
| DIENER plasma O2 (F-FRAI) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | DIENER | Nano |
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| Differential Scanning Calorimetry (C- DSC) | Caractérisation / characterization | Benjamin Reig | | NETZSCH | DSC 404 F3 Pegasus |
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| Digidrop (F-FRAI) | Caractérisation / characterization | Benjamin Reig | fabien mesnilgrente | GBX Instrument | Digidrop |
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View
| DILASE 3D HR (L- 3D) | Lithographie laser / Laser lithography | Pierre-François Calmon | Rémi Courson | KLOE | Dilase 3D |
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View
| DILASE 3D MR (L- 3D) | Lithographie laser / Laser lithography | Pierre-François Calmon | Rémi Courson | KLOE | Dilase 3DMR |
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View
| DILASE 650 (L- 2D) | Lithographie laser / Laser lithography | Pierre-François Calmon | David Colin | KLOE | DILASE 650 |
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View
| DILASE 750 (L- 2D) | Lithographie laser / Laser lithography | Pierre-François Calmon | David Colin | KLOE | DILASE 750 |
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View
| DWL 200 (L- DWL) | Lithographie laser / Laser lithography | Pierre-François Calmon | David Colin | HEIDELBERG INSTRUMENTS | DWL 200 |
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| Ellipsomètre HJY (C-SPEC) | Caractérisation / characterization | Benjamin Reig | Eric Imbernon | Horiba Jobin Yvon | Uvisel |
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| encolleuse (A-MONT) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | Janome | GLT JR2400N |
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| Etchlab 200 (G- ICP) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | SENTECH | Etchlab 200 |
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View
| étuve HMDS auto (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Yes | Yes |
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| étuve HMDS manuel (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Yes | Yes |
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View
| Etuve Horo (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | HORO | 250 |
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| étuve MEMMERT (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Memmert | UFB400 |
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| étuve polymères (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Memmert | XXXX |
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| Etuve TETHYS (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | TETHYS | Fisher-Band |
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| étuve Thermox (F-FRAI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Thermo scientific | Vacutherm |
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View
| Etuve vieillissement thermique (A-MONT) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | Secasi | BC21 |
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View
| EVA 600 Evaporation (D-PRST) | PVD | Ludovic Salvagnac | Guillaume Libaude | Alliance Concept | EVA 600 |
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View
| EVG120 (P-PHOT) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | EVG | 120 |
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| EVG620 (P-PHOT) | Photolithographie / Photolithography | Adrian Laborde | Laurent Mazenq | EVG | 620 |
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| Fer à souder Weller (F-FRAI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Weller | WSD81 |
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View
| FIB Dual Beam (C- FIB) | Caractérisation / characterization | Benjamin Reig | Franck Carcenac | FEI | Helios 600i |
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View
| Film monter UH-115 (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Ultron Systems, Inc. | UH-115 |
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| Form 3 (L- 3D) | Assemblage / Device mounting | Samuel Charlot | Rémi Courson | Formlabs | Form 3 |
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| Four AET Bore (T-FOUR) | Oxydation | Eric Imbernon | Jean Christophe Marrot | AET | Four d'oxydation |
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| Four AET Phosphore (T-FOUR) | Oxydation | Eric Imbernon | Jean Christophe Marrot | AET | Four d'oxydation |
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| Four AET Propre (T-FOUR) | Oxydation | Eric Imbernon | Jean Christophe Marrot | AET | Four d'oxydation |
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| Four AET Reve (T- CVD) | LPCVD | scheid emmanuel | Eric Imbernon | AET | SEP - 28486 |
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| Four Alox (T-FOUR) | Oxydation | Guilhem Almuneau | | AET | Four d'oxydation |
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| Four de refusion (A-INTE) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | Madell | TYR108C |
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View
| Four DIFPHOS6 (T-FOUR) | redistribution, diffusion | Eric Imbernon | Jean Christophe Marrot | Centrotherm | Centronic E1550HT |
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View
| Four OXYBORE6 (T-FOUR) | Oxydation | Eric Imbernon | Jean Christophe Marrot | Centrotherm | Centronic E1550HT |
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View
| Four OXYNIT6 (T- CVD) | LPCVD | Eric Imbernon | Pascal Dubreuil | Centrotherm | Centronic E1550HT |
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| Four OXYPHOS6 (T-FOUR) | Oxydation | Eric Imbernon | Jean Christophe Marrot | Centrotherm | Centronic E1550HT |
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| Four OXYPROP6 (T-FOUR) | Oxydation | Eric Imbernon | Jean Christophe Marrot | Centrotherm | Centronic E1550HT |
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View
| Four RECUIT6 (T-FOUR) | Recuits / Annealing | Eric Imbernon | Jean Christophe Marrot | Centrotherm | Centronic E1550HT |
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View
| Four SI3N46 (T- CVD) | LPCVD | Eric Imbernon | Pascal Dubreuil | Centrotherm | Centronic E1550HT |
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| Four SIPOLY6 (T- CVD) | LPCVD | Eric Imbernon | Pascal Dubreuil | Centrotherm | Centronic E1550HT |
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View
| Four Tempress Si-poly (T- CVD) | LPCVD | Eric Imbernon | Pascal Dubreuil | Tempress | Dépot LPCVD |
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View
| FTIR (C-SPEC) | Caractérisation / characterization | Benjamin Reig | Jean-Baptiste Doucet | BRUKER | TENSOR 27 |
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View
| fume hood exploratory chemistry (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | to be precised | to be checked |
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View
| GenISys lab (LOGICI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | GenISys | Lab v4.7.0 |
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View
| Gérard Bauzil room | Robots humanoïdes | Olivier STASSE | Guilhem Saurel | N/A | N/A |
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View
| Glove box for HF based chemistry (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | DVTECH | to be checked |
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View
| Gravure KOH (E-ANIS) | Procédés humides / Wet process benches | David Bourrier | Justine Bonneau | Minaservices | KOH |
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View
| Gravure TMAH (E-ANIS) | Procédés humides / Wet process benches | David Bourrier | Justine Bonneau | Minaservices | TMAH |
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View
| Grinder G&N (A-POLI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Grinder | MPS2 R300 D CS |
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View
| HMDS Obducat (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Obducat Solar Semi | QS V 200 BM 200°C |
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View
| HMP 90 (L- DWL) | Lithographie laser / Laser lithography | Pierre-François Calmon | David Colin | SUSS | HMP 90 |
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View
| Hotte implanteur (F-FRAI) | Implantation | Eric Imbernon | Jean Christophe Marrot | Minaservice | Hotte |
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View
| Hotte Litho laser (F-FRAI) | Lithographie laser / Laser lithography | Pierre-François Calmon | David Colin | DV Tech | Paillasse |
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| hotte montage (F-FRAI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | unknouwn | unknouwn |
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| Hotte nano (F-FRAI) | Nano imprint | Franck Carcenac | Jean-Baptiste Doucet | DVTEch | Hotte nano |
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View
| Hotte polissage (F-FRAI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | unknouwn | unknouwn |
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| hotte solvants (F-FRAI) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | Mina services | inox |
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| Hotte Wafer Bonder (F-FRAI) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | Devetek | no model |
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| HRP2-N14 | Robots humanoïdes | Olivier STASSE | | Kawada | HRP2 |
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View
| ICP2 III-V et NoMos (G- ICP) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | Trikon (SPTS) | Omega 201 (1996) |
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View
| ICP3 NoMos (G- ICP) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | Trikon (SPTS) | Omega 201 (1994) |
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View
| ICPECVD (T- CVD) | PECVD | Jean Christophe Marrot | Pascal Dubreuil | Oxford | Plasmalab 100 - HDPECVD |
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View
| Implanteur ionique IMC 200 (I-IMPL) | Implantation | Eric Imbernon | Jean Christophe Marrot | Eaton | NV 4206 |
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View
| Jauge de mesure d'épaisseur (A-POLI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Logitech | SYLVAC CH-1023 Crissier |
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View
| left organic solvents fume hood with lowerable window (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | Fluidair | to be checked |
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View
| MA6 Gen4 (P-PHOT) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Suss Microtec | MABA6Gen4 |
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View
| MBE2300 (M- EJM) | Epitaxie / Epitaxy | Alexandre Arnoult | quentin gravelier | RIBER SA | MBE2300 |
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View
| MBE32P (M- EJM) | Epitaxie / Epitaxy | Alexandre Arnoult | quentin gravelier | RIBER SA | MBE32P |
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View
| MBE412 (M- EJM) | Epitaxie / Epitaxy | Alexandre Arnoult | quentin gravelier | RIBER SA | MBE412 |
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View
| MEB S-3700N (C- MEB) | Caractérisation / characterization | Benjamin Reig | Franck Carcenac | HITACHI | S-3700N |
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| MEB S-4800 (C- MEB) | Caractérisation / characterization | Benjamin Reig | Franck Carcenac | HITACHI | S-4800 |
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View
| Mesure planéité (A-POLI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Logitech | GI20 |
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| Micro Injecteur (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Narishige | IM 300 |
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View
| microscope Leica (F-FRAI) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | Leica | EZ4D |
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| microscope leica photo auto (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Leica | DM4000M |
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| microscope leica photo manuel (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Leica | DM-4000M |
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View
| Microscope optique Leica (F-FRAI) | Caractérisation / characterization | Benjamin Reig | Avatar Benjamin | LEICA | DM4000 |
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View
| Micro-soudeuse Delvotec 5430 (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Delvotec | 5430 |
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View
| Micro-soudeuse KnS 4526 (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Kulicke and Soffa | 4526 |
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View
| Micro-soudeuse KnS 4700 (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Kulicke and Soffa | 4700 |
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View
| Micro-soudeuse KnS 484 (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Kulicke and Soffa | 484 |
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| Micro-soudeuse KnS 484x (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Kulicke and Soffa | 484 |
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| Micro-soudeuse TPT HB-16 5 (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | TPT | HB-16 |
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| MOS wet bench (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | Minaservice | mina-acidPP |
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View
| Motion Capture system in G. Bauzil | Robots humanoïdes | Olivier STASSE | Guilhem Saurel | Qualisys | Miqus M3 |
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View
| Nano-imprint equipment (N- NEX) | Nano imprint | Jean-Baptiste Doucet | Emmanuelle Daran | Nanonex | NX2500 |
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View
| NanoMOS wet bench (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | PTS-DVTECH | sorbonne |
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| Nettoyage wafers UH-117 (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Ultron Systems, Inc. | UH-117 |
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| Olympus MX50 (F-FRAI) | Caractérisation / characterization | Aurélie LECESTRE | laurent bouscayrol | Olympus | MX50 |
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View
| optical microscope NIKON (F-FRAI) | Caractérisation / characterization | Jean-Baptiste Doucet | Tom Gouveia | NIKON | to be checked |
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View
| oscilloscope (F-FRAI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Tektronix | TDS-2012 |
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| Paillasse Chime EJM - Solvants - III/V (F-FRAI) | Epitaxie / Epitaxy | quentin gravelier | Alexandre Arnoult | LAAS | Paillasse PVC LAAS |
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| Paillasse Chime EJM- Acides - III/V (F-FRAI) | Epitaxie / Epitaxy | quentin gravelier | Alexandre Arnoult | LAAS | Paillasse PVC LAAS |
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| Paillasse Chime EJM-1 (F-FRAI) | Epitaxie / Epitaxy | quentin gravelier | Alexandre Arnoult | LAAS | Paillasse PVC LAAS |
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| Paillasse de Développement & Stripping (F-FRAI) | Procédés humides / Wet process benches | David Bourrier | Justine Bonneau | LAAS | Developpement |
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| Paillasse de Développement & Ultrason (F-FRAI) | Procédés humides / Wet process benches | David Bourrier | Justine Bonneau | Minaservices | Ultrasons |
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| Paillasse dépôts Alternatifs (E-MANU) | Electrochimie/electroplating | David Bourrier | Justine Bonneau | LAAS | n°1 |
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| paillasse electroless (E-MANU) | Procédés humides / Wet process benches | Véronique Conédéra | fabien mesnilgrente | Coillard | paillasse pvc |
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| paillasse jet d'encre (F-FRAI) | Procédés humides / Wet process benches | fabien mesnilgrente | Véronique Conédéra | Coillard | paillasse pvc |
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| paillasse photo 1 : poste de développement (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Minaservice | NC |
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| paillasse photo 1 : tournette 1 (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Suss Microtec | LabSpin6 BM |
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| paillasse photo 2 : tournette 2 (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Suss Microtec | RC8 |
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| paillasse photo 2 :procédés spécifiques (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Minaservice | NC |
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| paillasse photo 3 :procédés MOS (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Minaservice | NC |
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| paillasse photo 3 :procédés MOS (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Suss Microtec | RC8 |
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View
| Parylene C30S (D-PARY) | PVD | Guillaume Libaude | Adrian Laborde | Comelec | C30S |
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View
| PECS (D-PRST) | PVD | Benjamin Reig | Franck Carcenac | GATAN | PECS |
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View
| PECVD 100 ApSy (T- CVD) | PECVD | Pascal Dubreuil | Jean Christophe Marrot | ApSy | Multiplex CVD |
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| PHOTONIC PROFESSIONAL (L- 3D) | Lithographie laser / Laser lithography | Pierre-François Calmon | David Colin | NANOSCRIBE | PHOTONIC PROFESSIONAL |
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| plaque chauffante 300°Cx (A-INTE) | Integration/ Device mounting | Samuel Charlot | David Bourrier | Sawatec | HP-401-Z |
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View
| plaque chauffante SU8 n°1 (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Suss Microtec | HP |
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| plaque chauffante SU8 n°2x (F-FRAI) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Suss Microtec | HP |
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View
| Plassys nano (D-PRST) | PVD | Ludovic Salvagnac | Guillaume Libaude | Plassys | Nano |
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| Plassys Organiques (D-OLED) | PVD | Ludovic Salvagnac | Guillaume Libaude | Plassys | MEB550B |
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| Polarographie (E-CARA) | Electrochimie/electroplating | David Bourrier | Justine Bonneau | Metrhom | 797 VA Computrace |
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View
| polisseuse CDP41 (A-POLI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Logitech | CDP41 |
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| polisseuse ESCIL (A-POLI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Escil | ESC200 |
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| Polisseuse PM5 (A-POLI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Logitech | PM5 |
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| Profilomètre mécanique Tencor P16+ (F-FRAI) | Caractérisation / characterization | Benjamin Reig | fabien mesnilgrente | KLA Tencor | Tencor P16+ |
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View
| Profilomètre mécanique Tencor P17 (F-FRAI) | Caractérisation / characterization | Benjamin Reig | fabien mesnilgrente | KLA Tencor | Tencor P17 |
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View
| Profilomètre optique LEXT (F-FRAI) | Caractérisation / characterization | Benjamin Reig | fabien mesnilgrente | Olympus | OLS LEXT 3100 |
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| Profilomètre optique Wyko (F-FRAI) | Caractérisation / characterization | Benjamin Reig | | VEECO | WYKO 3300 |
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View
| Pull shear testeur (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Xyztec | condor sygma |
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View
| Pyrene | Robots humanoïdes | Olivier STASSE | Guilhem Saurel | PAL-Robotics | TALOS |
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View
| RAITH150 (N-RAIT) | Lithographie électronique / Ebeam lithography | Franck Carcenac | Aurélie LECESTRE | RAITH | RAITH150 Version1 |
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| RCA/Piranha cleaning MOS (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | Tom Gouveia | VACO | to be checked |
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View
| Recuit Au et Cu sur Si (T-FOUR) | Recuits / Annealing | Eric Imbernon | Jean Christophe Marrot | ASM | Four horizontal LB 35 |
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View
| Recuit ferrite 6" (T-FOUR) | Recuits / Annealing | Jean Christophe Marrot | Eric Imbernon | AET | Bati de recuit 2 tubes MT/HT |
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View
| Recuit métaux divers sauf Au et Cu sur Si (T-FOUR) | Recuits / Annealing | Eric Imbernon | Jean Christophe Marrot | ASM | Four horizontal LB 35 |
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| Recuit métaux lourds 6" (T-FOUR) | Recuits / Annealing | Jean Christophe Marrot | Eric Imbernon | AET | Bati de recuit 2 tubes MT |
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| Recuit métaux sur substrats verre (T-FOUR) | Recuits / Annealing | Eric Imbernon | Jean Christophe Marrot | ASM | Four horizontal LB 35 |
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| Recuit Polyimide (T-FOUR) | Recuits / Annealing | Jean Christophe Marrot | Eric Imbernon | AET | Bati de recuit 2 tubes MT |
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| Recuit verre 6" (T-FOUR) | Recuits / Annealing | Jean Christophe Marrot | Eric Imbernon | AET | Bati de recuit 2 tubes MT/HT |
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View
| Rena Cuivre 4 pouces (E-AUTO) | Electrochimie/electroplating | David Bourrier | Justine Bonneau | RENA | EPM 100 F |
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| Rena Nickel 4 pouces (E-AUTO) | Electrochimie/electroplating | David Bourrier | Justine Bonneau | RENA | EPM 100 F |
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View
| Rena Or 4 pouces (E-AUTO) | Electrochimie/electroplating | David Bourrier | Justine Bonneau | RENA | EPM 100 F |
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View
| Report Eutectique (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | SET | sc910 |
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View
| Report eutectique KnS 6482 (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Kulicke and Soffa | 6482 |
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View
| Report flip chip (A-INTE) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | SET | FC150 |
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| Report/Collage Tresky T3000 (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Dr Tresky | T3000 |
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| Report/Collage Tresky T4907 (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Dr Tresky | T4907 |
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| réseau air sec | Support salle blanche | Hugues Granier | | SOME Industrie | Compair LRS22 10 bars |
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| Réseau éffluents gaz | Support salle blanche | Eric Imbernon | | Centrotherm | CT-BW |
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| Résistivimètre automatique (F-FRAI) | Caractérisation / characterization | Benjamin Reig | Eric Imbernon | Changmin Tech | CMT-SR200 |
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| Résistivimètre manuel (F-FRAI) | Caractérisation / characterization | Benjamin Reig | Eric Imbernon | --- | --- |
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| Riber degas (D-PRST) | PVD | Ludovic Salvagnac | Guillaume Libaude | Riber | Degas |
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| right organic solvents fume hood with lowerable window (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | Tom Gouveia | Fluidair | to be checked |
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| Romeo | Robots humanoïdes | Olivier STASSE | | Softbank robotics | Romeo 3 |
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| RTP As-Master (T-FOUR) | Recuits / Annealing | Jean Christophe Marrot | Eric Imbernon | Annealsys | AS-Master-2000HT |
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| RTP As-One (T-FOUR) | Recuits / Annealing | Jean Christophe Marrot | Eric Imbernon | Annealsys | AS-ONE |
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| Scie diamanté DAD-321 (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | DISCO | DAD-321 |
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| Scriber JFP-S100 (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Olivier Gauthier-Lafaye | CEFORI | JFP-S100 |
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| Scriber Karl-SUSS RH-100 (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Karl-SUSS | RH-100 |
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| Scriber SET (A-MONT) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | SET | A3 |
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| semitool Spin Rinse Dryer Main Chem (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | Semitool | PSC-101 |
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| sérigraphie (A-INTE) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | DEK | 01i |
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| SFD (J-TRAI) | Traitement de surface / Surface treatment | fabien mesnilgrente | | 31 degrees | SFD 200 |
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| Shipley 3024 (A-INTE) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | Shipley | 3024 |
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| Shipley 360 (A-INTE) | Integration/ Device mounting | Samuel Charlot | | Shipley | 360 |
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| SI500 (G- ICP) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | SENTECH | SI500 |
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| SI500-DRIE (G-DRIE) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | SENTECH | SI500-DRIE |
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| Sonication cabin (F-FRAI) | Other processes | Jean-Baptiste Doucet | | plasturgiste | Autotune |
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| SPD (J-TRAI) | Traitement de surface / Surface treatment | fabien mesnilgrente | | MEMSSTAR | SPD |
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| spectroline 248nm (F-FRAI) | Traitement de surface / Surface treatment | Véronique Conédéra | fabien mesnilgrente | spectroline | PC-2200A |
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| Spectromètre UV-VIS (C-SPEC) | Caractérisation / characterization | Benjamin Reig | | PerkinElmer | lambda650 |
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| Stepper Canon (P-PHOT) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Canon | FPA 3000i4/i5 |
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| Suss MA150 (P-PHOT) | Photolithographie / Photolithography | Adrian Laborde | Laurent Mazenq | Suss Microtec | 150 CC |
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| Suss MA6 (P-PHOT) | Photolithographie / Photolithography | Adrian Laborde | Laurent Mazenq | Suss Microtec | 6 |
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| Suss MJB3 GaAs (P-PHOT) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Suss Microtec | MJB3 |
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| Suss MJB3 Si (P-PHOT) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Suss Microtec | MJB3 |
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| Suss SprayCoater (P-PHOT) | Photolithographie / Photolithography | Laurent Mazenq | Adrian Laborde | Suss Microtec | Altaspray |
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| TEPLA plasma O2 (F-FRAI) | Gravure plasma / Plasma etching | Aurélie LECESTRE | laurent bouscayrol | TEPLA | 300 semi-auto |
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| Test Tool 2 | Support salle blanche | Martin (Admin) Klarqvist | | Intiro Development AB | One tool to rule them all |
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| Test Tool 3 | Support salle blanche | Martin (Admin) Klarqvist | | Intiro Development AB | One tool to rule them all 2 |
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| Test tool wrong | Support salle blanche | Hugues Granier | | Testbolaget | A |
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| Testeur sous pointes (F-FRAI) | Caractérisation / characterization | Benjamin Reig | Eric Imbernon | SET | TR5230 |
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| TFE 644 Pulvérisation (D-PRST) | PVD | Ludovic Salvagnac | Guillaume Libaude | Thin FIlm Equipment (TFE) | 644 |
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| Titration (E-CARA) | Electrochimie/electroplating | David Bourrier | Justine Bonneau | Metrhom | Titrando |
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| Tousimis (J-TRAI) | Traitement de surface / Surface treatment | fabien mesnilgrente | Véronique Conédéra | Tousimis | 915B |
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| Univex 450 Pulvérisation (D-PRST) | PVD | Ludovic Salvagnac | Guillaume Libaude | Oerlikon | Univex 450C |
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| UV -ozone (F-FRAI) | Traitement de surface / Surface treatment | Jean-Baptiste Doucet | Tom Gouveia | Jelight | 42-220 |
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| UV Ozone (F-FRAI) | Traitement de surface / Surface treatment | fabien mesnilgrente | Véronique Conédéra | Jelight | 42 |
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| Wafer bonder AML (A-INTE) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | AML | WB4 |
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| Wafer bonder SUSS (A-INTE) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | SUSS | SB6e |
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| Wafer Substrate Bonding (A-POLI) | Assemblage / Device mounting | Samuel Charlot | Samuel Charlot | Logitech | WSB1 |
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| Varian Evaporation (D-PRST) | PVD | Ludovic Salvagnac | Guillaume Libaude | MTB Solutions | Varian 3616 |
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| wet batch photoresist stripping by AZ100 remover (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | | VACO | to be checked |
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| wet bench III-V (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | Tom Gouveia | Coillard | to be checked |
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| wet bench metal etching (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | Tom Gouveia | VACO | wet bench |
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| wet bench organic solvents PDMS and outgasing (F-FRAI) | Procédés humides / Wet process benches | Jean-Baptiste Doucet | Tom Gouveia | PTS | Hotte |
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| viscosimètre (F-FRAI) | Integration/ Device mounting | Samuel Charlot | Samuel Charlot | Fungilab | smart |
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| viscosimètre(F-FRAI) | Caractérisation / characterization | fabien mesnilgrente | Véronique Conédéra | anton paar | AMVn |
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| Yamamoto 4'' (E-MANU) | Electrochimie/electroplating | David Bourrier | Justine Bonneau | Yamamoto | Smart Cell 4 '' |
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| Yamamoto Cuivre 4/6" (E-MANU) | Electrochimie/electroplating | David Bourrier | Justine Bonneau | LAAS | Plating Set 4'' and 6 '' |
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| Yamamoto Nickel 4/6" (E-MANU) | Electrochimie/electroplating | David Bourrier | Justine Bonneau | Yamamoto | Plating Set 4'' and 6 '' |