Picture of Wafer bonder AML MOS (A-INTE)
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Le dispositif de calibrage des plaquettes d'alignement AML modèle AWB-04 a la polyvalence nécessaire pour réaliser une liaison de verre anodique bien alignée et un collage direct des plaquettes de silicium. Il fournit également une plate-forme idéale pour le micro gaufrage à chaud de polymères ou l'alignement Nano bien aligné.

The AML Model AWB-04 aligner wafer bonder has the versatility to perform well-aligned anodic glass bonding and direct Si wafer bonding. It also provides an ideal platform for well-aligned polymer micro hot embossing or Nano imprinting.

Tool name:
Wafer bonder AML MOS (A-INTE)
Integration/Assemblage (Bât G1/G)
Integration/ Device mounting


  • In-situ visible and IR alignment with 1 micron accuracy
  • Ultimate vacuum: 5 x 10-6 mbar
  • Application of high voltages up to 2.5 kV
  • Max 560°C for tungsten upper and lower platens, max 450°C for graphite upper platen (for glass bonding)
  • Application of contact force up to 2 kN with tungsten platens
  • Wafer size: 3" and 4"
  • Forced nitrogen cooling option
  • Automatic storage of all the bonding parameters and event logs for graph plotting and trend analysis


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