Picture of Hotplate automated Thick Resists NoMOS (F-FRAI)
Current status:
AVAILABLE
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Responsibles
1st Responsible:
Adrian Laborde
2nd Responsible:
Laurent Mazenq
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Description

Osiris  baking system used at LAAS-CNRS since 2020.

Plaque chauffante Osiris utilisée au LAAS-cnrs depuis 2020

 

Details
Tool name:
Hotplate automated Thick Resists NoMOS (F-FRAI)
Area/room:
Lithographie laser : Laser Lithography (Bât G1)
Category:
Photolithographie / Photolithography
Manufacturer:
Osiris
Model:
HB20e
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Tool Modes
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