Picture of Hotplate automated Thick Resists (F-FRAI)
Current status:
AVAILABLE
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Osiris  baking system used at LAAS-CNRS since 2020.

Plaque chauffante Osiris utilisée au LAAS-cnrs depuis 2020

 

Tool name:
Hotplate automated Thick Resists (F-FRAI)
Area/room:
Lithographie laser : Laser Lithography (Bât G1)
Category:
Photolithographie / Photolithography
Manufacturer:
Osiris
Model:
HB20e
Max booking time, day:
4 hours
Max booking time, night:
12 hours
No. of future bookings:

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