Picture of FC150 MOS (A-INTE)
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Machine permettant le report et l'intégration précis de composants par face avant ou arrière.

Le report étant précis à +/-1µm en post alignement. L'intégration peut se faire par collage, thermocompression , eutectique, ultrasonique, UV ou brassage sous environnement réducteur (N2/HCOOH)

Machine allowing the report and the precise integration of components by face up ou down. The report being precise to +/- 1μm in post alignment. Integration can be done by gluing, thermocompression, eutectic, ultrasonic, UV or soldering on reducted environment (N2/HCOOH)

Tool name:
Integration/Assemblage (Bât G1/G)
Integration/ Device mounting
Max booking time, day:
6 hours
Max booking time, night:
0 hours
No. of future bookings:


  • Bonding Arm

Chip size: 0.2-50 mm 
Leveling: ± 0.57 degree, 0.4 arc.sec, 2 2rad step
Z (Arm): step 0.5 µm 
Heating: up to 450°C
Force (UBA): 0.03-200 kg 

  • Substrate chuck

Size: 1-150 mm
XY : 300x250  mm (1 2µm step)
Theta: ± 7 degrees  (1.8 arc.sec.  8.7µrad)
Z : 6 mm  (step:  0.25 µm)
Heating: Up to 450°C

  • Optics

Chip size: 0,2 – 40 mm
Autocollimator: Sensitivity: 5 arc.sec, 20 µrad
Microscope : (specs with 20x  lens), 400X magnification, F.o.V.  340 x 240 µm on monitor dia. 1mm in eye pieces
X/Y Stage: 143 x 44 mm (1µm step)


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