Picture of Hotplate automated n°1 NoMOS (F-FRAI)
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Suss Microtec  baking system used at LAAS-CNRS since 2024.

Allow automatic ramping baking process on 2", 4" and 6" wafers.

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Plaque chauffante Suss Microtec utilisée au LAAS-cnrs depuis 2024

Permet les recuits à rampe automatique pour wafers 2, 4 et 6 pouces.

Tool name:
Hotplate automated n°1 NoMOS (F-FRAI)
Area/room:
Photolithographies (Bât F)
Category:
Photolithographie / Photolithography
Manufacturer:
Suss Microtec
Model:
HP8

Temperature up to 150°C

Ramping speed : 5°C/min warming up, 2°C/min cooling down

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Temperature max de 150°C

Vitesse des rampes : 5°C/min en montée, 2°C/min en descente

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