Picture of Micro-soudeuse TPT HB-16 MOS (A-MONT)
Current status:
AVAILABLE
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Responsibles
1st Responsible:
Samuel Charlot
2nd Responsible:
Samuel Charlot
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Description

Micro-Soudeuse TPT HB-16


Equipement permettant la réalisation de micro-soudures Wedge et ball en deep access permettant de souder des fils d'or et d'aluminium allant de 17 à 75 µm sur des substrats métallisés.

TPT HB-16 Wire Bonder


Equipment allowing the realization of Wedge and ball micro-welds in deep access allowing to weld gold and aluminum wires ranging from 17 to 75 μm on metallized substrates.
 

 

 

Details
Tool name:
Micro-soudeuse TPT HB-16 MOS (A-MONT)
Area/room:
Assemblage (Bât G)
Category:
Assemblage / Device mounting
Manufacturer:
TPT
Model:
HB-16
Validated processes informations

Spécifications:

  • Gold, aluminium, silver & copper wire

Wire sizes from 17µm to 75µm Ribbon sizes up to 25x250µm

  •  Wedge, ball & ribbon bonding

Easy to switch between different bonding modes

  •  Repeatable Loop Profiles

Motorised axis allows precise loop repetition

  • 6.5" Touch Panel

6.5" Touch Panel provides easy, intuitive control

  •  Automatic bond height adjustment

Z-axis sensor identifies touch down & sets height parameters

  •  Simple Loop Programming

Create individual loop profiles consisting of up to 10 steps

  • Storage of 100 parameters

Storage & access of up to 100 parameter sets

  •  Deep & wide access

Ample work space due to special bond head design

  •  Motorised Wire Clamp

Precise tail length control

 

Instructors & Licensed Users

Instructors

Licensed Users

Tool Modes
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