Picture of Suss MA150 (P-PHOT)
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AVAILABLE
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SUSS MICROTEC semi-automatic Mask Aligner used at LAAS-CNRS since 1998. The system was retrofited in 2020.

This machine allow photoresist exposure on 4" wafers at 365nm (6.5mW) and 405nm (18.4mW) wavelengh in contact mode (vacuum,hard,soft) or proximity mode.

Following the retrofit of the MA150 equipment, the UV source has been modified.

The machine is now equipped with a Primelite ALE/1C UV system.

A standard process qualification is also made one time per month by photolitography team, results are available on LIMS website.

Specifications:

- TSA/BSA alignement

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Aligneur de masque semi-automatique SUSS MICROTEC en service au LAAS-CNRS depuis 1998. L'équipement a été retrofité en 2020.

Cet équipement permet d'exposer des wafers 4" à des longueurs d'onde de 365nm (6.5mW) and 405nm (18.4mW) en contact (vacuum,hard,soft) ou en proximité.

Cet aligneur utilise un système UV LED Primelite ALE/1C.

Une qualification des procédés est effectuée tous les mois par l'équipe de photolithographie, résultats visibles sur LIMS.

Specifications:

- TSA/BSA

Tool name:
Suss MA150 (P-PHOT)
Area/room:
Photolithographies (Bât F)
Category:
Photolithographie / Photolithography
Manufacturer:
Suss Microtec
Model:
150 CC
Max booking time, day:
3 hours
Max booking time, night:
0 hours
No. of future bookings:

Available mask sizes :  5  inch only

Available wafer sizes : 4 inch only (silicon and transparent wafers)

Alignement options : TSA and BSA , manual or automatic

MO Optic with manual wavelengh filters and diaphragm change possible

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Masque pris en charge : 5 pouces uniquement

Substrats pris en charge : 4 pouces unqiuement (wafers non transparents uniquement)

Type d'alignement : Face avant et face arrière, manuel

MO Optic avec changement manuel de filtres à longueur d'onde et diaphragmes.

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