Picture of Hotte Wafer Bonder (F-FRAI)
Current status:
AVAILABLE
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hotte permettant le nettoyage de wafer dédiés au scellement par wafer bonding. elle comprend des bacs thermostaté de type SC1 et SC2, un bac HF ainsi que 2 bacs de rincages muni de résistivimètre.


hood for wafer cleaning dedicated to wafer bonding. it includes thermostatic tanks type SC1 and SC2, an HF tank and 2 rinsing tanks with resistivity meter.
 

Tool name:
Hotte Wafer Bonder (F-FRAI)
Area/room:
Integration/Assemblage (Bât G1/G)
Category:
Integration/ Device mounting
Manufacturer:
Devetek
Model:
no model

Spécifications:

  • thermoregulated tank for SC1 cleanning
  • thermoregulated tank for SC2 cleanning
  • thermoregulated tank for HNO3 cleanning
  • HF tank
  • 2 DI water filling tank with resistivimeter

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