Picture of Four AET Phosphore (T-OXYD)
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Four de recuit après wafer bonding de plaquettes de Si.

Post wafer-bonding furnace for Si wafers

Tool name:
Four AET Phosphore (T-OXYD)
Area/room:
Traitements thermiques/thermal treament (Bâts F et
Category:
Oxydation
Manufacturer:
AET
Model:
Four d'oxydation
Max booking time, day:
10 hours
Max booking time, night:
10 hours
No. of future bookings:

Température de recuit de 700°C à 1150°C.

Annealing temperature between 700°C and 1150°C.

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