Picture of Four AET Phosphore (T-FOUR)
Current status:
DOWN
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Responsibles
1st Responsible:
Eric Imbernon
2nd Responsible:
Jean Christophe Marrot
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Description

Four de recuit après wafer bonding de plaquettes de Si.

Post wafer-bonding furnace for Si wafers

Details
Tool name:
Four AET Phosphore (T-FOUR)
Area/room:
Traitements thermiques/thermal treament (Bâts F et
Category:
Oxydation
Manufacturer:
AET
Model:
Four d'oxydation
Validated processes informations

Température de recuit de 700°C à 1150°C.

Annealing temperature between 700°C and 1150°C.

Instructors & Licensed Users

Instructors

Licensed Users

Tool Modes
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