Picture of Aligneur Suss (A-WAFB)
Current status:
AVAILABLE
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La plate-forme d'alignement BA8 est conçue pour les processus exigeants dans les secteurs de la production MEMS et LED et des marchés avancés de l'assemblage. Il aligne avec précision les substrats et sécurise leur position dans les appareils pour les étapes ultérieures du processus.


The BA8 bond alignment platform is designed for demanding processes in MEMS and LED production and advanced packaging markets. It accurately aligns substrates and secures their position in fixtures for further process steps. 
 

Tool name:
Aligneur Suss (A-WAFB)
Area/room:
Integration/Assemblage (Bât G1/G)
Category:
Integration/ Device mounting
Manufacturer:
SUSS
Model:
BA8
Max booking time, day:
4 hours
Max booking time, night:
4 hours
No. of future bookings:

Spécifications:

  • SUBSTRATES

Wafer size Up to 200 mm Square

substrate size Up to 200 x 200 mm

  • CONFIGURATIONS

Bond alignment Standard Direct pre-bonding

Optional pre-bonding toolkit Plasma activation

Optional SELECT toolkit Mask alignment Optional mask aligner toolkit

  • ALIGNMENT

Process Technologies Top-side, bottom-side, Optional: infrared alignment

Alignment accuracy Top-side alignment: 1 μm Bottom-side alignment:1 μm

  • ALIGNMENT STAGE

Travel range X ±3 mm

Travel range Y ±3 mm

Travel range Theta ±3°

  • WAFER BONDING

Process technologies Fusion pre-bonding, plasma activation

  • GRAPHICAL USER INTERFACE

Operating system Windows 7 Programs Unlimited number of recipes

Operation Remote access possible

  • UTILITIES, DIMENSIONS

Vacuum < 0.8 bar

Compressed Air 8 bar (116 psi)

Nitrogen 3 bar

Instructors

Licensed Users

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