Picture of TEPLA plasma O2 (F-FRAI))
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Cet équipement permet de réaliser, par plasma continu :
- Nettoyage de wafers avant tout procédé (ex : avant dépôt de résine).
- Délaquage de résines.
- Traitement de surface (hydrophile) des matériaux.

Chambre : cylindre en quartz (diamètre = 245mm ; profondeur = 380mm).
Source micro-onde : fréquence plasma = 2.45GHz ; puissance plasma = 60W à 1000W.
Température procédé : 20°C à 150°C.
Gaz : gaz1 = O2 ; gaz2 = CF4 ; gaz3 = SF6.
Vide limite (avant injection des gaz) : 0.2 à 0.4mb.
Pression de travail : ≈1.5mb
Puissance = 60W à 800W
Portes substrats pour des wafers 6’’, 4’’, et petits échantillons.

english version (2018) :
This equipment makes it possible to carry out, by continuous plasma:
- Cleaning of wafers before any process (ex: before resist deposition).
- Stripping of resists.
- Surface treatment (hydrophilic) of materials.
Chamber: quartz cylinder (diameter = 245mm, depth = 380mm).
Microwave source: plasma frequency = 2.45GHz; plasma power = 60W to 1000W.
Process temperature: 20 ° C to 150 ° C.
Gas: gas1 = O2; gas2 = CF4; gas3 = SF6.
Limit vacuum (before gas injection): 0.2 to 0.4mb.
Working pressure: ≈1.5mb
Power = 60W to 800W
Substrate carriers for 6 '', 4 '' wafers, and small samples.
Tool name:
TEPLA plasma O2 (F-FRAI))
Area/room:
Gravure plasma/plasma etching (Bât F)
Category:
Gravure plasma / Plasma etching
Manufacturer:
TEPLA
Model:
300 semi-auto
Max booking time, day:
2 hours
Max booking time, night:
2 hours
No. of future bookings:

Recipes

Flow O2

Power

Time

Applications

RECIPE 01

1000 sccm

800W

15min

Removing of thick resist (AZ40XT …)

RECIPE 02

1000 sccm

800W

5min

Removing of thin resist (ECI, N-Loff …)

RECIPE 03

1000 sccm

400W

5min

Glass / Removing of very thin resist

RECIPE 04

1000 sccm

200W

2min

Functionalization  / descumming

RECIPE 05

1000 sccm

60W

2min

Functionalization

 

 

 

 

 

RECIPE 06

400 sccm

60W

2min

Functionalization

RECIPE 07

400 sccm

200W

2min

Functionalization

RECIPE 08

400 sccm

400W

5min

Glass / Removing of very thin resist

RECIPE 09

400 sccm

800W

5min

Removing of thin resist (ECI, N-Loff …)

RECIPE 10

400 sccm

800W

30min

Removing of thick resist (AZ40XT …)

Instructors

Licensed Users

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